Bulletin of the Polish Academy of Sciences Technical Sciences

Applied Mechanics Reviews, ASM Materials Information, ASM International Institute of Materiais, Chemical Abstracts, Dynamical Information, Engineering Index, Geotechnical Abstracts – Geodex, Geotext Seryices, Key Words Index, Mathematical Abstracts, Mathematical Reviews, Physical Abstracts, Publishing and Information Services – INSPEC, Sciences Abstracts, UnCover, Zentralblatt für Mathematik, Science Citation Index Expanded, Journal Citation Reports/Science Edition, CSA Technology Research, CSA High Tech Research Database, CSA Aerospace & High Technology Database, CSA Electronics & Communications, CSA Solid State & Superconductivity, CSA Computer & Information Systems, CSA Materials Research Database, CSA Metadex, CSA Engineered Materials, CSA Aluminum Industry Abstracts, CSA Corrosion Abstracts, CSA Copper Technical Reference Library, CSA Ceramic Abstracts/World Ceramics Abstracts, CSA Engineering Research Database, CSA / ASCE Civil Engineering Abstracts, CSA Mechanical & Transportation Engineering, CSA Earthquake Engineering Abstracts, TEMA

Editor-in-Chief:
T. Kaczorek, Warsaw University of Technology

Deputy Editor-in Chief:
M.P. Każmierkowski, Division IV Technical Sciences PAN
A. Rogalski, Military University of Technology

Board of Co-editors:
Power and Energy
A. Styczek, Warsaw University of Technology

Civil Engineering
L. Czarnecki, Warsaw University of Technology

Mechanical Engineering
A. Tylikowski, Warsaw University of Technology

Materials Science and Engineering
B. Major, Institute of Metallurgy and Materials Science PAN

Nanotechnology
T.A. Kowalewski, Institute of Fundamental Technological Research PAN

Bioengineering and Biotechnology
R. Maniewski, Institute of Biocybernetics and Biomedical Engineering PAN

Electronics and Telecommunication
M. Białko, Koszalin University of Technology

Optoelectronics and Photonics
W. Woliński, Warsaw University of Technology

Control and Informatics
J. Klamka, Silesian Technical University

Artificial Intelligence and Circuits
S. Osowski, Warsaw University of Technology

Electrical Engineering
M. Kaźmierkowski, Warsaw University of Technology

International Editorial Advisory Board
I.V. Alexandrov, Ufa State Aviation Technical University, Russia
R. Asthana, University of Wiscontin-Stout, Menomonie, USA
Xu Binshi, China Association of Plant Engineering, Beijing, P.R. China
R. Ebner, Materials Centre Leoben, Leoben, Austria
E. Fornasini, Universita’ Degli Studi di Padova, Padova, Italy
M. Gad-el-Hak, Virginia Commonwealth University, Richmond, USA
L. Keviczky, Hungarian Academy of Sciences, Budapest, Hungary
V. Kučera, Czech Technical University in Prague, Prague, Czech Republic
G. Maier, Technical University of Milan, Milan, Italy
H.A. Mang, Austrian Academy of Sciences, Vienna, Austria
Du Xiangwan, Chinese Academy of Engineering, China
H. Mihashi, Tohoku University, Aoba-ku, Sendai, Japan
S. Mindess, University of British Columbia, Vancouver, Canada
D.A. Mlynski, University of Karlsruhe, Karlsruhe, Germany
A.S. Nowak, University of Michigan, Ann Arbor, USA
A. Öberg, Linköping University, Linköping, Sweden
S. Przemieniecki, University of South Florida, Tampa, USA
M. Razeghi, Northwestern University, Evanston, USA
J.V. Sloten, Catholic University Leuven, Leuven, Belgium
W. Włosiński, Warsaw University of Technology, Warsaw, Poland
D. Wolf, J.W. Goethe-Universitat, Frankfurt am Main, Germany
A.L. Yarin, Institute of Illinois at Chicago, USA
J. Żurada, Department of Computer Engineering, University of Louisville, USA

Copy Editor
E.Kiczko, e-mail: biuletyn@pan.pl

Contact
Pałac Kultury i Nauki, Pl. Defilad l, 00-901 Warsaw, Poland
tel.: +48(22)6203303, 6566498, fax: +48(22)8262996
http://bulletin.pan.pl
e-mail: biuletyn@pan.pl