Jump to ContentJump to Main Navigation

Online

99,00 € / $149.00*

* Prices subject to change. Shipping costs will be added if applicable.
Publication Date:
March 2004
ISSN:
2191-6349

See all formats and pricing

Online
Individual Subscription Online only
Euro [D] 99.00
RRP for USA, Canada, Mexico
US$ 149.00 *
Print
Individual Subscription Online only
Euro [D] 656.00
RRP for USA, Canada, Mexico
US$ 983.00 *
Print + Online
Individual Subscription Online only
Euro [D] 788.00
RRP for USA, Canada, Mexico
US$ 1180.00 *
*Prices subject to change. Shipping costs will be added if applicable.

Frequenz

Journal of RF-Engineering and Telecommunications

Editor-in-Chief: Jakoby, Rolf

Editorial Board Member: Bangert, Axel / Böck, Georg / Bose, Ranjan / Detlefsen, Jürgen / Djordjevic, Ivan B. / Follmann, Rüdiger / Fuchs, Günter / Gaspard, Ingo / Gevorgian, Spartak / Hartnagel, Hans / Hofmann, Klaus / Jondral, Friedrich / Kasper, Erich / Kastell, Kira / Klein, Anja / Knöchel, Reinhard / Kuchenbecker, Hans-Peter / Küppers, Franko / Kürner, Thomas / Menzel, Wolfgang / Mönich, Gerhard / Pouhe, David / Rembold, Bernhard / Rohling, Hermann / Schmidt, Lorenz-Peter / Schünemann, Klaus / Thomä, Reiner / Vossiek, Martin / Weigel, Robert / Weiland, Thomas / Zoubir, Abdelhak

6 Issues per year

IMPACT FACTOR 2011: 0.124
5-year IMPACT FACTOR: 0.265

VolumeIssuePage

Issues

Issue 3-4 (Mar 2004), pp. 49 - 104

Design Aspects of Self-Sufficient Distributed MicroSystems

Niedermayer, Michael / Polityko, David Dmitry / Fotheringham, Gerhard / Guttowski, Stephan / John, Werner

Page 54

Flexible Circuit Carrier with Integrated Passives for High Density Integration

Fischer, Thorsten / Zoschke, Kai / Scherpinski, Katrin / Buschick, Klaus / Ehrmann, Oswin / Wolf, M. Jürgen / Reichl, Herbert

Page 58

Ultra Thin Flip Chip Interconnects

Haberland, Julian / Kallmayer, Christine

Page 65

System Architecture for Low Power 24 GHz Front-End

von der Mark, Stefan / Huber, Meik / Wittwer, Mathias / Heinrich, Wolfgang / Boeck, Georg

Page 70

Integrated Circuits and 3D-Packaging for Low-Power 24 GHz Front End

Meliani, Chafik / Talukder, Prodyut / Hilsenbeck, Jochen / Huber, Meik / Böck, Georg / Heinrich, Wolfgang

Page 74

Antenna Concepts for Ubiquitous Communication Networks: The Case of AVM

Angwafo, Nchewah / Wittwer, Mathias / von der Mark, Stefan / Mönich, Gerhard

Page 80

Distributed Middleware for Global Knowledge in Sensor Networks

Hänsel, Robert / Mauch, Olga / Radusch, Ilja / Steglich, Stephan / Popescu-Zeletin, Radu

Page 97

Demonstration of Autarkie Distributed Microsystems with Existing Hybrid Technologies

Lang, Klaus-Dieter / Großer, Volker / Rochlitzer, Robby / Quaas, Holger

Page 103

Comments (0)

Please log in or register to comment.