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Licensed Unlicensed Requires Authentication Published by De Gruyter June 1, 2005

RF and Thermal Design of Compound Semiconductor Devices using MEMS Approach

  • B. Mottet, , C. Sydlo, , K. Mutamba, , O. Cojocari, and H. L. Hartnagel,
From the journal Frequenz
https://doi.org/10.1515/FREQ.2005.59.5-6.131
Published Online: 2005-06-01

©2011 by Walter de Gruyter GmbH & Co.

From the journal
Frequenz
Frequenz
Volume 59 Issue 5-6
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Articles in the same Issue

Foreword / Vorwort
Design and Experimental Verification of Correction Algorithms for Improving the Measurement Accuracy of a Broadband Vector IF Receiver at 160 MHz
Ultra-Low-Power Rectification in Passive RFID Tags at UHF Frequencies
Design and Realization of a Compact Multi-Resonator Bandpass Filter for C-Band Earth Station Antennas
SABA: A Real-time MIMO Testbed at X-Band
Azimuthally Corrugated Structures: Basic Types, Applications, and Perspectives of Development
RF and Thermal Design of Compound Semiconductor Devices using MEMS Approach
Thin-film microstrip lines and coplanar waveguides on semiconductor substrates for sub-mm wave frequencies
Design of a Controllable Attenuator with High Dynamic Range for THz-Frequencies based on Optically Stimulated Free Carriers in High-Resistivity Silicon
Hochfrequenzsysteme in Beschleunigern für die medizinische Partikeltherapie
High Frequency Ultrasonic Imaging: System Design and Performance Optimization
Gas Discharge Impedance and Transmission Line Voltages in a RF Excited CO2 Slab Laser
Principal Component Analysis in Radar Polarimetry
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