In laser processing, the possible throughput is directly scaling with the available average laser power. To avoid unwanted thermal damage due to high pulse energy or heat accumulation during MHz-repetition rates, energy distribution over the workpiece is required. Polygon mirror scanners enable high deflection speeds and thus, a proper energy distribution within a short processing time. The requirements of laser micro processing with up to 10 kW average laser powers and high scan speeds up to 1000 m/s result in a 30 mm aperture two-dimensional polygon mirror scanner with a patented low-distortion mirror configuration. In combination with a field programmable gate array-based real-time logic, position-true high-accuracy laser switching is enabled for 2D, 2.5D, or 3D laser processing capable to drill holes in multi-pass ablation or engraving. A special developed real-time shifter module within the high-speed logic allows, in combination with external axis, the material processing on the fly and hence, processing of workpieces much larger than the scan field.
Author contributions: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved submission.
Research funding: None declared.
Conflict of interest statement: The authors declare no conflicts of interest regarding this article.
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