Skip to content
Licensed Unlicensed Requires Authentication Published by De Gruyter October 21, 2022

Novel procedure for the identification of a starting point for the CMP

  • Christian Trum EMAIL logo , Sebastian Sitzberger and Rolf Rascher

Abstract

In the field of precision optics, more and more glass materials that are difficult to machine are being used because of their interesting optical properties. At the same time, the geometries are getting more demanding and the tolerances to be achieved are tighter. The establishment of an efficient process chain is therefore becoming an ever-greater challenge. Particularly in the field of CMP, knowledge of the machining properties of pads and slurries are required to design efficient processes. This knowledge has to be gained through time-consuming in-house tests, as the manufacturers of the consumables are usually only able to provide basic data. In addition, the boundary conditions under which the data were collected are often incomplete defined and thus not comparable. The novel methodical procedure presented here for the initial design of CMP processes is based on a standardized procedure for carrying out the tests. From the resulting database, a starting point for the design of own processes can be identified quickly and unerringly. This article describes the structure of the procedure as well as the necessary background. In addition, the visualization and the procedure for selecting start parameters are discussed using an example application.


Corresponding author: Christian Trum, IPH, Technische Hochschule Deggendorf, Deggendorf, Germany, E-mail:

  1. Author contributions: All the authors have accepted responsibility for the entire content of this submitted manuscript and approved submission.

  2. Research funding: None declared.

  3. Conflict of interest statement: The authors declare no conflicts of interest regarding this article.

References

[1] S. Hambücker, Technologie der Politur sphärischer Optiken mit Hilfe der Synchrospeed-Kinematik. Zugl.: Aachen, Techn. Hochsch., Diss., Aachen Shaker, 2001.Search in Google Scholar

[2] D. Wächter, Wirkweise des Poliermittelträgers beim Polieren optischer Gläser. Aachen, Apprimus Wissenschaftsverlag, 2018, [Online]. Available at: http://​search.ebscohost.com​/​login.aspx​?​direct=​true&​scope=​site&​db=​nlebk&​AN=​1684254.Search in Google Scholar

[3] M. Bielmann, U. Mahajan, and R. K. Singh, “Effect of particle size during tungsten chemical mechanical polishing,” Electrochem. Solid State Lett., vol. 2, no. 8, p. 401, 1999, https://doi.org/10.1149/1.1390851.Search in Google Scholar

[4] H. S. Lee, H. D. Jeong, and D. A. Dornfeld, “Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes,” Precis. Eng., vol. 37, no. 2, pp. 483–490, 2013, https://doi.org/10.1016/j.precisioneng.2012.12.006.Search in Google Scholar

[5] Z. Zhang, W. Liu, and Z. Song, “Particle size and surfactant effects on chemical mechanical polishing of glass using silica-based slurry,” Appl. Opt., vol. 49, no. 28, pp. 5480–5485, 2010, https://doi.org/10.1364/ao.49.005480.Search in Google Scholar

[6] Z. Zhang, W. Liu, and Z. Song, “Effect of abrasive particle concentration on preliminary chemical mechanical polishing of glass substrate,” Microelectron. Eng., vol. 87, no. 11, pp. 2168–2172, 2010, https://doi.org/10.1016/j.mee.2010.01.020.Search in Google Scholar

[7] J. Cao, C. Wei, S. Liu, et al.., “Polishing performances of different optics with different size powder and different pH value slurries during CMP polishing,” in Optifab 2015: Proc. SPIE 9633, New York, United States, Rochester, 2015, p. 96332O.10.1117/12.2218455Search in Google Scholar

[8] U. Mahajan, Fundamental Studies on Silicon Dioxide Chemical Mechanical Polishing, Gainsville, Florida, Dissertation, University of Florida, 2000.Search in Google Scholar

[9] E. Becker, Chemisch-mechanische Politur von optischen Glaslinsen. Zugl.: Aachen, Techn. Hochsch., Diss., Aachen Shaker, 2011.Search in Google Scholar

[10] E. Becker, A. Prange, and R. Conradt, “Simulation of the chemical influences to the polishing process of optical glasses,” Adv. Magn. Reson., vols. 39–40, pp. 293–298, 2008, https://doi.org/10.4028/www.scientific.net/AMR.39-40.293.Search in Google Scholar

[11] M. J. Cumbo, D. Fairhurst, D. S. Jacobs, and B. E. Puchebner, “Slurry particle size evolution during the polishing of optical glass,” Appl. Opt., vol. 34, no. 19, pp. 2743–3755, 1995, https://doi.org/10.1364/AO.34.003743.Search in Google Scholar PubMed

[12] H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Char., vol. 49, no. 1, pp. 35–44, 2002, https://doi.org/10.1016/S1044-5803(02)00285-1.Search in Google Scholar

[13] B. Park, H. Lee, K. Park, H. Kim, and H. Jeong, “Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry,” J. Mater. Process. Technol., vol. 203, nos. 1–3, pp. 287–292, 2008, https://doi.org/10.1016/j.jmatprotec.2007.10.033.Search in Google Scholar

[14] J. Luo and D. A. Dornfeld, “Material removal mechanism in chemical mechanical polishing: theory and modeling,” IEEE Trans. Semicond. Manuf., vol. 14, no. 2, pp. 112–133, 2001.10.1109/66.920723Search in Google Scholar

[15] J. Luo and D. A. Dornfeld, “Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification,” IEEE Trans. Semicond. Manuf., vol. 16, no. 3, pp. 469–476, 2003, https://doi.org/10.1109/TSM.2003.815199.Search in Google Scholar

[16] B. S. Kim, M. H. Tucker, J. D. Kelchner, and S. P. Beaudoin, “Study on the mechanical properties of CMP pads,” IEEE Trans. Semicond. Manuf., vol. 21, no. 3, pp. 454–463, 2008, https://doi.org/10.1109/TSM.2008.2001223.Search in Google Scholar

[17] D. Castillo-Mejia, S. Gold, V. Burrows, and S. Beaudoin, “The effect of interactions between water and polishing pads on chemical mechanical polishing removal rates,” J. Electrochem. Soc., vol. 150, no. 2, p. G76, 2003, https://doi.org/10.1149/1.1531973.Search in Google Scholar

[18] F. W. Preston, “The theory and design of plate glass polishing machines,” J. Society Glass Technol., vol. 11, pp. 214–256, 1927.Search in Google Scholar

[19] DIN ISO 10110-7:2018-05 , Optics and Photonics-Preparation of Drawings for Optical Elements and Systems: Part 7: Surface Imperfections (ISO 10110-7:2017), DIN Deutsches Institut für Normung e.V., Berlin. 2018.Search in Google Scholar

[20] I. Schubert, Wissensspeicher Feinoptik: 17.4, Apold, Ingo Schubert, 2017.Search in Google Scholar

Received: 2022-06-01
Accepted: 2022-10-05
Published Online: 2022-10-21
Published in Print: 2022-12-16

© 2022 Walter de Gruyter GmbH, Berlin/Boston

Downloaded on 29.3.2024 from https://www.degruyter.com/document/doi/10.1515/aot-2022-0022/pdf
Scroll to top button