Abstract
The integration of dies is a possibility to reduce the number of conducting tracks within electrical active implants. For passive microelectrode arrays the number of conducting tracks limits the number of electrodes. By embedding an array of small dies (250 μm edge length) employed to amplify and multiplex the signals of 25 electrodes each into a flexible foil we create a flexible active microelectrode array with more than 1000 electrodes. A fabrication process was developed containing a transfer process for the dies as well as an embedding procedure. Here a non-functional Dummy-System is presented as a demonstrator proving the feasibility of the proposed microelectrode array.
© 2018 the author(s), published by Walter de Gruyter Berlin/Boston
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