Skip to content
Licensed Unlicensed Requires Authentication Published by De Gruyter August 21, 2018

Effect of Pin-Fin Geometry on Microchannel Performance

Subhash V. Jadhav, Prashant M. Pawar and Babruvahan P. Ronge

Abstract

Purpose

A numerical analysis is carried out to study the effect of pin fin geometry on the performance of microchannel heat sinks.

Design/methodology/approach

A three-dimensional numerical analysis is carried out using the conjugate heat transfer module of COMSOL MULTIPHYSICS software. Initially, the study is carried out for a microchannel heat sink with elliptical pin fins of 500 µm fin height, and the results of the same are validated with the results obtained from the literature. Further, the effect of different pin fin shapes and pin fin heights is investigated in terms of Nusselt number and pressure drop. The analysis is carried out with different pin fin shapes viz. ellipse, circle, square and hexagon. The pin fin height for all channels is varied from 300 µm to 700 µm. The total surface area of the channel coming into contact with coolant is kept constant for different coolant inflow velocities.

Findings

Higher values of Nusselt numbers are obtained for fin pins at larger height and high coolant inlet velocities. At coolant inlet velocity of 1 m/s, as pin fin height increases from 300 µm to 700 µm, the channel with circular pin fins shows a maximum increment of 66 % and elliptical pin fins shows a minimum increment of 40 % in terms of Nusselt number. A maximum value of Nusselt number observed is 21.36 with square pin fins of 700 µm fin height and a minimum of 6.03 Nusselt number with circular fins of 300 µm fin height.

OriginalityOriginality/Value

This study is useful in appropriate selection of pin fin geometry for enhancing the performance of microchannel heat sink.

Nomenclature

u

Average axial velocity (m/s)

W

width (µm)

t

Channel wall Thickness (µm)

L

Channel length (µm)

Re

Reynolds number

ρ

Density (kg/m3)

μ

Dynamic viscosity

T

Temperature (K)

q

Heat flux (W/m2)

h

Convective heat transfer coefficient (W/m2 K)

K

Thermal conductivity (W/m K)

f

Fanning friction factor (14.23/Re)

Nu

Nusselt Number (hDc/K)

Pc

the wetted perimeter of the channel

p

Pressure(Pa)

Dc

Hydraulic diameter of the channel (4Ac/Pc)

References

[1] Tuckerman DB, Pease RFW. High-performance heat sinking for VLSI. IEEE Electron Device Lett. 1981;2:126–29.10.1109/EDL.1981.25367Search in Google Scholar

[2] Cheng YJ. Numerical simulation of stacked microchannel heat sink with mixing-enhanced passive structure. Int Commun Heat Mass Transfer. 2007;34:295–303.10.1016/j.icheatmasstransfer.2006.12.007Search in Google Scholar

[3] Jinliang X, Yanxi S, Wei Z, Hua Z, Yunhua G. Numerical simulations of interrupted and conventional microchannel heat sinks. Int J Heat Mass Transf. 2010;51:5906–17.Search in Google Scholar

[4] John TJ, Mathew B, Hegab H. Parametric study on the combined thermal and hydraulic performance of single phase micro pin-fin heat sinks part I: square and circle geometries. Int J Thermal Sci. 2010;49:2177–90.10.1016/j.ijthermalsci.2010.06.011Search in Google Scholar

[5] Minghou L, Dong L, Sheng X, Yiliang C. Experimental study on liquid flow and heat transfer in the micro square pin fin heat sink. Int J Heat Transfer. 2011;54:5602–11.10.1016/j.ijheatmasstransfer.2011.07.013Search in Google Scholar

[6] Monoj B, Anupam D, Mahanta P. Performance of elliptical pin fin heat exchanger with three elliptical perforations. CFD Lett. 2011;3:65–73.Search in Google Scholar

[7] Tullius JF, Tullius TK, Bayazitoglu Y. Optimization of short micro pin fins in minichannels. Int J Heat Mass Transf. 2012;55:3921–32.10.1016/j.ijheatmasstransfer.2012.03.022Search in Google Scholar

[8] Hafiz MA, Adrian B. Condensation of R-113 on Pin-Fin Tubes: effect of circumferential pin thickness and spacing. Heat Transfer Eng. 2012;33:205–12.10.1080/01457632.2011.548296Search in Google Scholar

[9] Carlos AR, Satish GK, Abel H. Performance of online and offset micro pin-fin heat sinks with variable fin density. IEEE Trans Compon Packag Manuf Technol. 2013;3:86–93.10.1109/TCPMT.2012.2225143Search in Google Scholar

[10] Chiu HC, Hsieh RH, Jang JH. Numerical analysis of the heat transfer of heat sink with micro-pin-fins. ECS Trans. 2013;52:759–64.10.1149/05201.0759ecstSearch in Google Scholar

[11] Afiz MA, Adrian B. Condensation heat transfer on pin-fin tubes: effect of thermal conductivity and pin height. Appl Thermal Eng. 2013;60:465–71.10.1016/j.applthermaleng.2012.08.020Search in Google Scholar

[12] Haleh S, Omid A, Khosrow J, Goodarz A. Numerical study of heat transfer performance of single-phase heat sinks with micro pin-fin structures. Appl Thermal Eng. 2013;58:68–76.10.1016/j.applthermaleng.2013.04.008Search in Google Scholar

[13] Hafiz MA, Adrian B. An investigation of condensate retention on pin-fin tubes. Appl Thermal Eng. 2014;63:503–10.10.1016/j.applthermaleng.2013.11.038Search in Google Scholar

[14] Saad AJ, Wajahat A, Hafiz MAA, Aysha MA. Water Cooled Mini Channel Heat Sinks for Microprocessor Cooling: Effect of Fin Spacing. Appl Thermal Eng. 2014;64:76–82.10.1016/j.applthermaleng.2013.12.007Search in Google Scholar

[15] Turker İ, Mustafa K, Ali K. The effect of micro pin-fin shape on thermal and hydraulic performance of micro pin-fin heat sinks. J Heat Transfer Eng. 2015;36:1447–57.10.1080/01457632.2015.1010921Search in Google Scholar

[16] Hafiz MA, Adrian B. A semi-empirical model for free-convection condensation on a horizontal pin–fin tubes. Int J Heat Mass Transf. 2015;81:157–66.10.1016/j.ijheatmasstransfer.2014.10.008Search in Google Scholar

[17] Tzer MJ, Sheng CT. Numerical simulation of laminar forced convection of pin-fin heat sink array in a channel by using porous approach. Appl Sci. 2015;5:1846–68.10.3390/app5041846Search in Google Scholar

[18] Jin Z, Shanbo H, Liang G, Zhaoqin H. Numerical study and optimizing on a micro square pin-fin heat sink for electronic cooling. Appl Thermal Eng. 2016;93:1347–59.10.1016/j.applthermaleng.2015.08.105Search in Google Scholar

[19] Aysha MS, Waqas A, Hafiz MA, Muzaffar A, Muhammad AN. Evaluation of nanofluids performance for simulated microprocessor. Thermal Sci. 2017;21:2227–36.10.2298/TSCI150131159SSearch in Google Scholar

[20] Kirsch KL, Thol KA. Pressure loss and heat transfer performance for additively and conventionally manufactured pin fin arrays. Int J Heat Mass Transf. 2017;108:2502–13.10.1016/j.ijheatmasstransfer.2017.01.095Search in Google Scholar

[21] Hafiz MA, Muhammad MG, Faseeh A, Muhammad I. Experimental investigation of nucleate pool boiling heat transfer enhancement of TiO2-water-based nanofluids. Appl Thermal Eng. 2017;113:1146–51.10.1016/j.applthermaleng.2016.11.127Search in Google Scholar

[22] Hafiz MA*, Muhammad ZQ. Free convection condensation of steam on horizontal wire wrapped tubes: effect of wire thermal conductivity, pitch, and diameter. Appl Thermal Eng. 2015;90:207–14.10.1016/j.applthermaleng.2015.07.006Search in Google Scholar

[23] Saad AJ, Ali W, Hafiz MA. Multiwalled carbon nanotube nanofluid for thermal management of high heat generating computer processor. Heat Transfer. 2014;43:653–66.Search in Google Scholar

[24] Hafiz MA, Waqas A. Effect of channel angle of the pin-fin heat sink on heat transfer performance using water-based graphene nanoplatelets nanofluids. Int J Heat Mass Transf. 2017;106:465–72.10.1016/j.ijheatmasstransfer.2016.08.061Search in Google Scholar

[25] Ali HM, Briggs A. Condensation of ethylene glycol on pin-fin tubes: effect of circumferential pin spacing and thickness. Appl Thermal Eng. 2012;49:9–13.10.1016/j.applthermaleng.2011.08.017Search in Google Scholar

[26] Waqas A, Hafiz MA. Graphene nanoplatelets nanofluids thermal and hydrodynamic performance on integral fin heat sink. Int J Heat Mass Transf. 2017;107:995–1001.10.1016/j.ijheatmasstransfer.2016.10.127Search in Google Scholar

[27] Hafiz MA, Muhammad A. Effect of vapour velocity on condensate retention on horizontal pin-fin Tubes. Energy Convers Manage. 2014;86:1001–09.10.1016/j.enconman.2014.06.064Search in Google Scholar

Received: 2018-04-15
Revised: 2018-07-14
Accepted: 2018-07-15
Published Online: 2018-08-21

© 2019 Walter de Gruyter GmbH, Berlin/Boston