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BY-NC-ND 3.0 license Open Access Published by De Gruyter March 7, 2014

Microstructural Evolution of TLP Bonded Ti3Al-Nb Alloy Joints

  • X.Y. Gu , Z.Z. Duan , X.P. Gu EMAIL logo and D.Q. Sun


In the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy joints using a pure copper as interlayer was investigated. TLP bonded Ti3Al-Nb alloy joints composed of intermetallic compound layers were produced. Microstructural evolution of joints depended on both bonding time and bonding temperature. With increasing bonding time and bonding temperature, the joint width increased and amount of compounds in the joint decreased. The joint microstructure at 1173 K × 1 min mainly consisted of Ti (solid solution) + Ti2Cu + TiCu + Ti3Cu4 + Ti2Cu3 + TiCu4 + Cu (solid solution) phase and it changed to Ti (solid solution) + Ti2Cu + TiCu at 1223 K × 60 min. Compounds formed on cooling from the bonding temperature by liquid phase were eliminated from the joint at 1223 K × 60 min due to isothermal solidification of liquid phase. The increase of the width of joint is attributed to the composition difference between the isothermal solidification production and its adjacent base material.

PACS: 64.70.kd
Received: 2013-7-29
Accepted: 2013-12-12
Published Online: 2014-3-7
Published in Print: 2014-12-1

©2014 by Walter de Gruyter Berlin/Munich/Boston

This article is distributed under the terms of the Creative Commons Attribution Non-Commercial License, which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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