Okazaki, Kenji, Eguchi, Yoichi and Conrad, Hans. "Thermal and Athermal Solid Solution Strengthening in Ti-Aland Ti-Sn Alloys"
International Journal of Materials Research, vol. 67, no. 10, 1976, pp. 665-671.
https://doi.org/10.1515/ijmr-1976-671003
Okazaki, K., Eguchi, Y. & Conrad, H. (1976). Thermal and Athermal Solid Solution Strengthening in Ti-Aland Ti-Sn Alloys.
International Journal of Materials Research,
67(10), 665-671.
https://doi.org/10.1515/ijmr-1976-671003
Okazaki, K., Eguchi, Y. and Conrad, H. (1976) Thermal and Athermal Solid Solution Strengthening in Ti-Aland Ti-Sn Alloys. International Journal of Materials Research, Vol. 67 (Issue 10), pp. 665-671.
https://doi.org/10.1515/ijmr-1976-671003
Okazaki, Kenji, Eguchi, Yoichi and Conrad, Hans. "Thermal and Athermal Solid Solution Strengthening in Ti-Aland Ti-Sn Alloys"
International Journal of Materials Research 67, no. 10 (1976): 665-671.
https://doi.org/10.1515/ijmr-1976-671003
Okazaki K, Eguchi Y, Conrad H. Thermal and Athermal Solid Solution Strengthening in Ti-Aland Ti-Sn Alloys.
International Journal of Materials Research. 1976;67(10): 665-671.
https://doi.org/10.1515/ijmr-1976-671003
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