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Licensed Unlicensed Requires Authentication Published by De Gruyter November 16, 2021

Relationship between Molecular Orientation Relaxation during Physical Aging and Heat Resistance of Polystyrene Injection Moldings

  • K. Tao , K. Yamada , S. Higashi , K. Kago , H. Takeshita and K. Tokumitsu


This work examined the relationship between changes in molecular orientation and the heat resistance (heat distortion temperature) of polystyrene injection moldings following heat treatment below the glass transition temperature. Molecular orientation around the core layer of the injection moldings was found to be relaxed by the heat treatment. Also, in the untreated specimen, the molecular orientation around the core layer was relaxed from 60°C during the heating process. Since loss tangent (tanδ) also increased from 60°C during the heating process in the untreated specimen, it was considered that the increase in tanδ occurred with the molecular motion due to the relaxation of molecular orientation from 60°C. After the heat treatment, because of the relaxation of molecular orientation around the core layer by the heat treatment, the relaxation of molecular orientation from 60 °C did not occur during the subsequent heating process, and the tanδ of the polymer between 60 and 90 °C was decreased. Because this decrease in the tanδ over this temperature range improved the heat resistance of the material, the enhanced heat resistance by the heat treatment was attributed to the suppression of the relaxation of molecular orientation from 60°C during the heating process. Furthermore, relaxation of molecular orientation and enthalpy relaxation were related to improvement in the heat resistance.

Kousaku Tao, Polymer Processing Laboratory, Research Division of Materials Science and Engineering, Morinomiya Center, Osaka Research Institute of Industrial Science and Technology, 1-6-50, Morinomiya, Joto-ku, Osaka-city, Osaka 536-8553, Japan


We thank Michael D. Judge, MSc, from Edanz Group ( for editing a draft of this manuscript.


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Received: 2021-01-28
Accepted: 2021-05-27
Published Online: 2021-11-16

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