Accessible Requires Authentication Published by De Gruyter July 8, 2011

Mechanical and thermal properties of polymer micro- and nanocomposites

Stephan J. Picken, Alexander V. Korobko, Eduardo Mendes, Ben Norder, Veronika V. Makarova, Gleb B. Vasilyev, Valeriy V. Karbushev and Mariya Yu. Tolstykh
From the journal

Abstract

We have analyzed the thermal conductivity and the tensile modulus of composite materials within the framework of the Halpin-Tsai and Lewis-Nielsen models. The parameter linking thermal conductivity and tensile modulus together is the shape factor of the (nano)filler. Model analysis based on experimental data shows that particle aggregation into a weak mechanical network may be required to achieve good correlation between thermal conductivity and the Young’s modulus when analyzing the data within the framework of a single model and requiring the same value of the shape factor. We believe this approach will make quantitative analysis of nanocomposite thermal properties possible.

Published Online: 2011-07-08
Published in Print: 2011-07-01

©2011 by Walter de Gruyter Berlin Boston