We demonstrate the metallization of amino-terminated, cross-linked biphenylthiol self-assembled monolayers (SAMs) via Pd catalysed electroless deposition (ELD) of Cu. Angle resolved X-ray photoelectron spectroscopy and atomic force microscopy were used for characterization. Lateral cross-linking and generation of terminal amino groups are induced by irradiation with low energy electrons. The cross-linked SAM suppresses the ELD of Cu onto the Au substrate. By the immobilization of Pd atoms to the terminal amino groups, catalytic sites are created in cross-linked areas. These sites then facilitate the electroless deposition of Cu on top of the SAM.
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