Yee-Wen Yen , Weng-Ting Chou , Hong-Chih Chen , Wei-Kai Liou and Chiapyng Lee

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints

De Gruyter | Published online: June 11, 2013