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Licensed Unlicensed Requires Authentication Published by De Gruyter April 15, 2013

Analysis of thermal stability after occurrence of absolute solute trapping in undercooled Co–Cu alloy

  • X. Q. Yang , Z. Chen , W. Yang and J. T. Liu

Thermal stability after recalescence of the single-phase supersaturated granular grains prepared in Co-15 at.%Cu immiscible alloy melt was investigated. As for undercooled Co–Cu alloy, a transition from dendritic to granular crystals occurred when ΔT ≥ ΔT∗, which was induced by an abrupt change in the dendritic growth mechanism from solute-controlled to purely thermally-controlled growth. However, the recalescence effect led to grain growth and solute segregation of trapped Cu to grain boundaries. On this basis, a thermo-kinetic model applicable for nano-scale materials was extended to the system of micro-scale undercooled Co–Cu alloy. The model showed close agreement with the experimental results. It is concluded that Cu atoms captured by solute trapping re-segregated to grain boundaries, which was responsible for the reduction in grain boundary energy and improvement in thermal stability in undercooled Co–Cu alloy.

d Correspondence address, X.Q. Yang, School of Chemical Engineering and Technology, China University of Mining and Technology, Xuzhou, Jiangsu, P.R. China, Tel.: +086-0516-83591066, Fax: +086-0516-83591059, E-mail:


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Received: 2012-9-9
Accepted: 2013-2-22
Published Online: 2013-04-15
Published in Print: 2013-08-08

© 2013, Carl Hanser Verlag, München

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