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Analysis of thermal stability after occurrence of absolute solute trapping in undercooled Co–Cu alloy

X. Q. Yang, Z. Chen, W. Yang and J. T. Liu

Thermal stability after recalescence of the single-phase supersaturated granular grains prepared in Co-15 at.%Cu immiscible alloy melt was investigated. As for undercooled Co–Cu alloy, a transition from dendritic to granular crystals occurred when ΔT ≥ ΔT∗, which was induced by an abrupt change in the dendritic growth mechanism from solute-controlled to purely thermally-controlled growth. However, the recalescence effect led to grain growth and solute segregation of trapped Cu to grain boundaries. On this basis, a thermo-kinetic model applicable for nano-scale materials was extended to the system of micro-scale undercooled Co–Cu alloy. The model showed close agreement with the experimental results. It is concluded that Cu atoms captured by solute trapping re-segregated to grain boundaries, which was responsible for the reduction in grain boundary energy and improvement in thermal stability in undercooled Co–Cu alloy.


d Correspondence address, X.Q. Yang, School of Chemical Engineering and Technology, China University of Mining and Technology, Xuzhou, Jiangsu, P.R. China, Tel.: +086-0516-83591066, Fax: +086-0516-83591059, E-mail:

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Received: 2012-9-9
Accepted: 2013-2-22
Published Online: 2013-04-15
Published in Print: 2013-08-08

© 2013, Carl Hanser Verlag, München