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Licensed Unlicensed Requires Authentication Published by De Gruyter February 7, 2014

Development of Sn–Cu–Sb alloys for making lead- and bismuth-free pewter

Yew Hoong Wong, S. Ramesh, C. Y. Tan and B. Projjal


A systematic study on the development of a set of Sn–Cu–Sb alloys and their characteristics, such as phases evolved, mechanical properties, physical properties, and microstructures, that are commonly sought for making pewter is presented. Alloys with various nominal compositions of Sn–Cu (1–3%)–Sb (3–6%) were prepared and they were die cast for complete characterization. The samples were characterized for hardness, malleability, density, microstructure, and phase identification. The study is expected to help in selecting the right composition of the alloys for making pewter with appropriate combination of properties.

* Correspondence address, Dr. Yew Hoong Wong, Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia, Tel.: +603-7967 7022 ext 2654, Fax: +603-7967 5317, E-mail:


[1] S.Kalpakjian: Manufacturing Engineering and Technology, Prentice Hall, New Jersey (2001).Search in Google Scholar

[2] J.A.Jacobs, T.F.Kildulf: Engineering Materials Technology: Structures, Processing, Properties & Selection, Prentice Hall, New Jersey (1997).Search in Google Scholar

[3] M.B.Dessuy, M.G.R.Vale, B.Welz, A.R.Borges, M.M.Silva, P.B.Martelli: Talanta85 (2011) 681. PMid:21645758; 10.1016/j.talanta.2011.04.050Search in Google Scholar

[4] Q.Zeng, J.Guo, X.Gu, X.Zhao, X.Liu: J. Mater. Sci. Technol.26 (2010) 156. 10.1016/S1005-0302(10)60026-6Search in Google Scholar

[5] J.Han, H.Chen, M.Li, C.Wang: J. Mater. Sci. Technol.29 (2013) 471. 10.1016/j.jmst.2013.01.012Search in Google Scholar

[6] J.F.Young, R.S.Shane: Materials and Processes Part A: Materials, Marcel Dekker, New York (1985).Search in Google Scholar

[7] D.M.Laskin: Oral and Maxillofacial Surgery, Mosby (1980).Search in Google Scholar

[8] W.D.CallisterJr: Materials Science and Engineering – An Introduction, Wiley, New York (2003).Search in Google Scholar

[9] H.Lee, M.Chen: Mater. Sci. Eng. A333 (2002) 24. 10.1016/S0921-5093(01)01820-2Search in Google Scholar

[10] D.Lin, G.X.Wang, T.S.Srivatsan, M.Al-Hajri, M.Petraroli: Mater. Lett.53 (2002) 333. 10.1016/S0167-577X(01)00503-1Search in Google Scholar

[11] W.F.Smith, J.Hashemi: Foundations of Materials Science and Engineering, McGraw-Hill, New York (2006).Search in Google Scholar

[12] K.J.Puttlitz, K.A.Stalter: Handbook of Lead-free Solder Technology for Microelectronic Assemblies, CRC Press, Florida (2004). 10.1201/9780203021484Search in Google Scholar

Received: 2013-05-22
Accepted: 2013-08-26
Published Online: 2014-02-07
Published in Print: 2014-02-10

© 2014, Carl Hanser Verlag, München

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