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Licensed Unlicensed Requires Authentication Published by De Gruyter May 2, 2013

Mechanical Cross-Sectioning of Au/Cu Wire Ball Bond with Underneath Cu/low-k Interconnect Layers

Mechanische Herstellung von Querschliffen aus Au/Cu-Draht-Kugel-Verbunden mit darunter liegenden Cu/low-k Verbindungsschichten
  • Sarangapani Murali and Narasimalu Srikanth
From the journal Practical Metallography

Abstract

Standard metallographic cross-sectioning of copper and gold wire bonds with underneath Cu/low-k interconnect layers are difficult, easily they fracture during polishing. It can be overcome by appropriate liquid molding methodology and polishing using semi-automatic system at very low frictional forces and using finer alumina or diamond lapping films. SEM observation of the polished microstructures up to 5000–8000× magnification does not reveal micro cracks or smearing of copper.

Kurzfassung

Die Herstellung von metallographischen Standard-Querschliffen von Kupfer- und Gold-Drahtbonds mit darunter liegenden Cu/low-k-Verbindungsschichten ist schwierig, da diese sehr leicht während des Polierprozesses brechen. Durch eine geeignete Flüssig-Verguss-Methode und durch Polieren mit einem halbautomatischen System bei sehr geringen Reibungskräften und durch Einsatz von feinerer Tonerde oder Diamantläppfilmen kann dies leicht beherrscht werden. REM-Beobachtungen der polierten Gefüge bis zu Vergrößerungen von 5000- bis 8000-fach zeigten keine Mikrorisse oder Verschmierungen von Kupfer.


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Übersetzung: G. Poech


Literatur / References

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Received: 2006-4-11
Accepted: 2006-6-21
Published Online: 2013-05-02
Published in Print: 2007-03-01

© 2007, Carl Hanser Verlag, München

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