Ultra-short laser radiation is used in manifold industrial applications today. Although state-of-the-art laser sources are providing an average power of 10–100 W with repetition rates of up to several megahertz, most applications do not benefit from it. On the one hand, the processing speed is limited to some hundred millimeters per second by the dynamics of mechanical axes or galvanometric scanners. On the other hand, high repetition rates require consideration of new physical effects such as heat accumulation and shielding that might reduce the process efficiency. For ablation processes, process efficiency can be expressed by the specific removal rate, ablated volume per time, and average power. The analysis of the specific removal rate for different laser parameters, like average power, repetition rate or pulse duration, and process parameters, like scanning speed or material, can be used to find the best operation point for microprocessing applications. Analytical models and molecular dynamics simulations based on the so-called two-temperature model reveal the causes for the appearance of limiting physical effects. The findings of models and simulations can be used to take advantage and optimize processing strategies.