Lead frames are generated in large quantities by modern semiconductor packaging industry and they contain significant concentrations of valuable tin, nickel, and copper. For electrowinning of tin from waste lead frames, hydrochloric acid leaching of tin is quite advantageous, but solution stability, electrolytic efficiency and deposit morphology should be optimized before commercialization. HCl electrolyte was diluted (distilled water: HCl = 350:150) for electrowinning of waste lead frames at 40 °C with 0.2 A/cm 2 and Ti-Ir cathode. After 4 h electrowinning, 99% pure Sn with 99.1% recovery rate was produced. Therefore, aqueous HCl electrolyte was quite effective for electrowinning of Sn leaching solution, and a higher recovery rate of purer Sn within shorter electrowinning time was obtained.