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Current Directions in Biomedical Engineering

Joint Journal of the German Society for Biomedical Engineering in VDE and the Austrian and Swiss Societies for Biomedical Engineering

Editor-in-Chief: Dössel, Olaf

Editorial Board: Augat, Peter / Buzug, Thorsten M. / Haueisen, Jens / Jockenhoevel, Stefan / Knaup-Gregori, Petra / Kraft, Marc / Lenarz, Thomas / Leonhardt, Steffen / Malberg, Hagen / Penzel, Thomas / Plank, Gernot / Radermacher, Klaus M. / Schkommodau, Erik / Stieglitz, Thomas / Urban, Gerald A.

CiteScore 2018: 0.47

Source Normalized Impact per Paper (SNIP) 2018: 0.377

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Different encapsulation strategies for implanted electronics

Comparison of titanium, ceramic and silicone material for implant body

Sebastian Winkler
  • Corresponding author
  • Fraunhofer Institute for Machine Tools and Forming Technology, Reichenhainer Straße 88, 09126 Chemnitz, Germany
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/ Jan Edelmann / Christine Welsch / Roman Ruff
Published Online: 2017-09-07 | DOI: https://doi.org/10.1515/cdbme-2017-0153


Recent advancements in implant technology include increasing application of electronic systems in the human body. Hermetic encapsulation of electronic components is necessary, specific implant functions and body environments must be considered. Additional functions such as wireless communication systems require specialized technical solutions for the encapsulation.

In this paper 3 different implant strategies based on the material groups silicone, ceramics and titanium alloys are evaluated. With the background of a specific application the requirements for the encapsulation are defined and include the implementation of electrical feedthroughs, wireless communication and wireless energy transfer as well as biomedical specifications such as hermetic sealing, mechanical stability and biocompatibility. The encapsulations are manufactured and qualified experimentally.

Keywords: implant; encapsulation; titanium; silicone; ceramics

About the article

Published Online: 2017-09-07

Citation Information: Current Directions in Biomedical Engineering, Volume 3, Issue 2, Pages 725–728, ISSN (Online) 2364-5504, DOI: https://doi.org/10.1515/cdbme-2017-0153.

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©2017 Sebastian Winkler et al., published by De Gruyter. This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License. BY-NC-ND 4.0

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