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Current Directions in Biomedical Engineering

Joint Journal of the German Society for Biomedical Engineering in VDE and the Austrian and Swiss Societies for Biomedical Engineering

Editor-in-Chief: Dössel, Olaf

Editorial Board: Augat, Peter / Buzug, Thorsten M. / Haueisen, Jens / Jockenhoevel, Stefan / Knaup-Gregori, Petra / Kraft, Marc / Lenarz, Thomas / Leonhardt, Steffen / Malberg, Hagen / Penzel, Thomas / Plank, Gernot / Radermacher, Klaus M. / Schkommodau, Erik / Stieglitz, Thomas / Urban, Gerald A.

CiteScore 2018: 0.47

Source Normalized Impact per Paper (SNIP) 2018: 0.377

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Silicone-based Chip-in-Foil System

Lena Bleck
  • Corresponding author
  • NMI Natural and Medical Sciences Institute at the University of Tübingen, Markwiesenstr. 55, Reutlingen, Germany
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/ Andreas Heid / Rene von Metzen
  • NMI Natural and Medical Sciences Institute at the University of Tübingen, Reutlingen, Germany
  • Other articles by this author:
  • De Gruyter OnlineGoogle Scholar
Published Online: 2018-09-22 | DOI: https://doi.org/10.1515/cdbme-2018-0033


Aiming at devices for bioelectronic medicine, this paper proposes a die embedding process for the fabrication of flexible smart implants. By combining thinned bare dies with a polymeric encapsulation, completely flexible implants can be designed. The dies are encapsulated using a flip-chip process and a backfilling with silicone rubber. A completely even surface without detectable edge between the chip and the surrounding polymer substrate is achieved by gluing the chips face-down onto a polyimide-covered substrate. The backside is coated with silicone rubber and a second carrier substrate is attached. Removing the first substrate subsequent to curing of the silicone leads to chips located under a continuous polyimide layer, enabling the use of microtechnology for further processing steps. A custom-made test chip is proposed that enables the evaluation of the mechanical and chemical stability of the system.

Keywords: chip-in-foil; smart implant; neural implant; electroceuticals; bioelectronics medicine; active implant; miniaturized; die embedding

About the article

Published Online: 2018-09-22

Published in Print: 2018-09-01

Citation Information: Current Directions in Biomedical Engineering, Volume 4, Issue 1, Pages 131–134, ISSN (Online) 2364-5504, DOI: https://doi.org/10.1515/cdbme-2018-0033.

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