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Chemistry International

The News Magazine of IUPAC

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Volume 25, Issue 1

Issues

16th International Symposium on Plasma Chemistry

Published Online: 2009-09-01 | DOI: https://doi.org/10.1515/ci.2003.25.1.28a

16th International Symposium on Plasma Chemistry

- IUPAC-sponsored event*

22–27 June 2003, Taormina, Italy

ISPC is a biennial international conference with topics encompassing the whole area of plasma chemistry. The aim of the symposium is to present the recent progress in plasma chemistry and its applications. The symposium will be organized into plenary lectures, parallel oral sessions (invited and contributed presentations), and poster sessions. The whole area of plasma processing will be covered, from thermal to non-equilibrium plasmas, and from fundamentals to applications and engineering. In particular, the following sessions are being planned:

  • fundamentals of plasma-surface interactions

  • gas-phase plasma diagnostics

  • modelling in plasma chemistry

  • non-equilibrium effects in plasma chemistry

  • plasma sources

  • plasma processing for microelectronics

  • PECVD/treatment of semi-conductors and related materials

  • plasma deposition of inorganic and hard coatings

  • plasma deposition and treatment of polymers

  • clusters, particles, and powders

  • plasma chemical synthesis

  • plasma spray and thermal plasma material processing

  • hybrid plasma/radiation processes

Contributions are solicited in application areas such as biomaterials, waste treatment, barrier and protective coatings, dielectric barrier discharges, plasma welding, microelectronics, hard coatings, ophthalmics, tribology, and others.

The symposium will also include a plasma equipment exhibition and will be preceded by two IUPAC summer schools. The IUPAC Summer Schools on Plasma Chemistry, to be held 18–20 June 2003, are addressed to graduate students, scientists, technical staff, and managers interested in an updated view of modern plasma applications. The schools are as follows:

Thermal Plasma Processing of Materials (Chaired by Professor P. Fauchais, University of Limoges, France), which will cover the following: introduction, overview of industrial plasma processes, thermal plasma thermodynamic and transport properties, plasma generation, plasma characterization, plasma as a processing medium (interaction with a gas, interaction with a condensed material, and interaction with a dispersed medium).

Cold Plasma Processing of Materials (Chaired by Professor R. d’Agostino, University of Bari, Italy), which will cover the following: fundamentals, plasma chemistry of deposition treatment and etching processes, reactor architecture, properties of PECVD coatings and plasma treated surfaces, plasma diagnostics, surface diagnostics, applications of plasma processed materials.

One additional School on Plasma Processes for Microelectronics (Chaired by Professor F. Fracassi, University of Bari, Italy) will also be organized prior to the symposium. This course will cover the most important issues related to dry etching and plasma enhanced chemical vapor deposition, with particular consideration of new and envisaged processes utilized in semiconductor manufacturing. The school is particularly suggested for process engineers, technical staff, and managers in microelectronics.

See Calendar for contact information

www.ispc16.org

* Sponsorship by IUPAC attests to the quality of the scientific program and indicates the host country's assurance that scientists from all countries may participate.

> Sponsorship Information

Page last modified 21 December 2002.

Copyright © 2002 International Union of Pure and Applied Chemistry.

Questions regarding the website, please contact edit.ci@iupac.org

About the article

Published Online: 2009-09-01

Published in Print: 2003-01-01


Citation Information: Chemistry International -- Newsmagazine for IUPAC, Volume 25, Issue 1, Pages 28–28, ISSN (Online) 1365-2192, ISSN (Print) 0193-6484, DOI: https://doi.org/10.1515/ci.2003.25.1.28a.

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