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High Temperature Materials and Processes

Editor-in-Chief: Fukuyama, Hiroyuki

Editorial Board: Waseda, Yoshio / Fecht, Hans-Jörg / Reddy, Ramana G. / Manna, Indranil / Nakajima, Hideo / Nakamura, Takashi / Okabe, Toru / Ostrovski, Oleg / Pericleous, Koulis / Seetharaman, Seshadri / Straumal, Boris / Suzuki, Shigeru / Tanaka, Toshihiro / Terzieff, Peter / Uda, Satoshi / Urban, Knut / Baron, Michel / Besterci, Michael / Byakova, Alexandra V. / Gao, Wei / Glaeser, Andreas / Gzesik, Z. / Hosson, Jeff / Masanori, Iwase / Jacob, Kallarackel Thomas / Kipouros, Georges / Kuznezov, Fedor


IMPACT FACTOR 2018: 0.427
5-year IMPACT FACTOR: 0.471

CiteScore 2018: 0.58

SCImago Journal Rank (SJR) 2018: 0.231
Source Normalized Impact per Paper (SNIP) 2018: 0.377

Open Access
Online
ISSN
2191-0324
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Volume 30, Issue 1-2

Issues

Laser Powder Welding of a Ti52Al46.8Cr1Si0.2Titanium Aluminide Alloy at Elevated Temperature

C. A. Smal / C. G. Meacock / H. J. Rossouw
Published Online: 2011-04-19 | DOI: https://doi.org/10.1515/htmp.2011.023

Abstract

A method for the joining of a Ti52Al46.8Cr1Si0.2Titanium Aluminide alloy by laser powder welding is presented. The technique acts to join materials by consolidating powder with focused laser beam to form weld beads that fill a V joint. In order to avoid the occurrence of residual thermal stresses and hence cracking of the brittle material, the weld plates were heated to a temperature of 1173 K (= 900 °C) by an ohmic heating device, welded and then slowly cooled to produce pore and crack free welds.

Keywords.: Laser welding; titanium aluminide; solidification cracking

About the article

Corresponding author: C. A. Smal, Laser Materials Processing, CSIR, PO Box 395, Pretoria 0001, South Africa


Received: 2010-10-21

Accepted: 2010-11-12

Published Online: 2011-04-19

Published in Print: 2011-04-01


Citation Information: High Temperature Materials and Processes, Volume 30, Issue 1-2, Pages 157–160, ISSN (Online) 2191-0324, ISSN (Print) 0334-6455, DOI: https://doi.org/10.1515/htmp.2011.023.

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