Jump to ContentJump to Main Navigation
Show Summary Details
More options …

Journal of the Mechanical Behavior of Materials

Editor-in-Chief: Aifantis, Katerina

Managing Editor: Skoryna, Juliusz


CiteScore 2018: 0.79

SCImago Journal Rank (SJR) 2018: 0.263
Source Normalized Impact per Paper (SNIP) 2018: 0.135

Open Access
Online
ISSN
2191-0243
See all formats and pricing
More options …
Volume 10, Issue 3

Issues

Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation

Y. Zhao, / C. Basaran, / A. Cartwright, / T. Dishongh,
Published Online: 2011-04-27 | DOI: https://doi.org/10.1515/JMBM.1999.10.3.135

About the article

Published Online: 2011-04-27

Published in Print: 1999-06-01


Citation Information: Journal of the Mechanical Behavior of Materials, Volume 10, Issue 3, Pages 135–146, ISSN (Online) 2191-0243, ISSN (Print) 0334-8938, DOI: https://doi.org/10.1515/JMBM.1999.10.3.135.

Export Citation

©2011 by Walter de Gruyter GmbH & Co..Get Permission

Citing Articles

Here you can find all Crossref-listed publications in which this article is cited. If you would like to receive automatic email messages as soon as this article is cited in other publications, simply activate the “Citation Alert” on the top of this page.

[1]
Hong Tang and Cemal Basaran
International Journal of Damage Mechanics, 2001, Volume 10, Number 3, Page 235
[2]
Y Zhao, C Basaran, A Cartwright, and T Dishongh
Mechanics of Materials, 2000, Volume 32, Number 3, Page 161
[3]
Cemal Basaran and Hong Tang
International Journal of Damage Mechanics, 2002, Volume 11, Number 1, Page 87
[4]
C. Basaran, S. Nie, C.S. Hutchins, and H. Ergun
International Journal of Damage Mechanics, 2008, Volume 17, Number 2, Page 123
[5]
Paul Barton
IEEE Instrumentation & Measurement Magazine, 2007, Volume 10, Number 4, Page 10
[6]
T. Dishongh, C. Basaran, A.N. Cartwright, Ying Zhao, and Heng Liu
IEEE Transactions on Advanced Packaging, 2002, Volume 25, Number 3, Page 433
[7]
H. Liu, C. Basaran, A.N. Cartwright, and W. Casey
IEEE Transactions on Components and Packaging Technologies, 2004, Volume 27, Number 1, Page 217
[8]
Yujun Wen and Cemal Basaran
Journal of Electronic Packaging, 2003, Volume 125, Number 1, Page 134
[9]
Cemal Basaran and Yujun Wen
Journal of Electronic Packaging, 2003, Volume 125, Number 3, Page 426
[10]
Hong Tang and Cemal Basaran
Journal of Electronic Packaging, 2003, Volume 125, Number 1, Page 120
[11]
Hua Ye, Douglas C. Hopkins, and Cemal Basaran
Microelectronics Reliability, 2003, Volume 43, Number 12, Page 2021
[12]
C Basaran, H Tang, and S Nie
Mechanics of Materials, 2004, Volume 36, Number 11, Page 1111
[13]
Yujun Wen and Cemal Basaran
Mechanics of Materials, 2004, Volume 36, Number 4, Page 369

Comments (0)

Please log in or register to comment.
Log in