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Metrology and Measurement Systems

The Journal of Committee on Metrology and Scientific Instrumentation of Polish Academy of Sciences

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Volume 22, Issue 1


The Investigation of Conductive Via Properties

Dominik Jurkow
  • Corresponding author
  • Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11117, 50-372 Wroclaw, Poland
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/ Mateusz Dorczynski
  • Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11117, 50-372 Wroclaw, Poland
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  • De Gruyter OnlineGoogle Scholar
/ Leszek Golonka
  • Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11117, 50-372 Wroclaw, Poland
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Published Online: 2015-02-20 | DOI: https://doi.org/10.1515/mms-2015-0007


The investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Design of the Experiment (DoE) methodology in such validation and discusses usefulness and drawbacks of the chosen solution. The optimized technology of via filling will be applied in the fabrication of tactile displays for blind people.

Keywords: L TCC; DoE; design; experiment; via; electrical


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About the article

Received: 2014-03-25

Accepted: 2014-10-29

Published Online: 2015-02-20

Published in Print: 2015-03-01

Citation Information: Metrology and Measurement Systems, Volume 22, Issue 1, Pages 39–50, ISSN (Online) 2300-1941, DOI: https://doi.org/10.1515/mms-2015-0007.

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© Polish Academy of Sciences. This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License. BY-NC-ND 3.0

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