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Metrology and Measurement Systems

The Journal of Committee on Metrology and Scientific Instrumentation of Polish Academy of Sciences

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Volume 23, Issue 3 (Sep 2016)

Issues

A Review of Surface Deformation and Strain Measurement Using Two-Dimensional Digital Image Correlation

Sze-Wei Khoo
  • Corresponding author
  • Universiti Tunku Abdul Rahman, Jalan Universiti, Department of Industrial Engineering, Bandar Barat, 31900 Kampar, Perak, Malaysia
  • Universiti Teknologi PETRONAS, Department of Mechanical Engineering, 32610 Bandar Seri Iskandar, Perak, Malaysia
  • Email
  • Other articles by this author:
  • De Gruyter OnlineGoogle Scholar
/ Saravanan Karuppanan / Ching-Seong Tan
Published Online: 2016-07-14 | DOI: https://doi.org/10.1515/mms-2016-0028

Abstract

Among the full-field optical measurement methods, the Digital Image Correlation (DIC) is one of the techniques which has been given particular attention. Technically, the DIC technique refers to a non-contact strain measurement method that mathematically compares the grey intensity changes of the images captured at two different states: before and after deformation. The measurement can be performed by numerically calculating the displacement of speckles which are deposited on the top of object’s surface. In this paper, the Two-Dimensional Digital Image Correlation (2D-DIC) is presented and its fundamental concepts are discussed. Next, the development of the 2D-DIC algorithms in the past 33 years is reviewed systematically. The improvement of 2DDIC algorithms is presented with respect to two distinct aspects: their computation efficiency and measurement accuracy. Furthermore, analysis of the 2D-DIC accuracy is included, followed by a review of the DIC applications for two-dimensional measurements.

Keywords: surface deformation; strain measurement; two-dimensional digital image correlation

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About the article

Received: 2015-10-15

Accepted: 2016-04-10

Published Online: 2016-07-14

Published in Print: 2016-09-01


Citation Information: Metrology and Measurement Systems, ISSN (Online) 2300-1941, DOI: https://doi.org/10.1515/mms-2016-0028.

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[2]
Haifeng Xu, Duyi Ye, and Linbo Mei
Materials Science and Engineering: A, 2017, Volume 700, Page 530
[3]
B Aksoy, A Rehman, H Bayraktar, and B E Alaca
Journal of Micromechanics and Microengineering, 2017, Volume 27, Number 4, Page 045008

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