Jump to ContentJump to Main Navigation
Show Summary Details

Multiferroic Materials

1 Issue per year

Emerging Science

Open Access

    Open Access
    See all formats and pricing


    Multiferroic Materials is closed for submissions since 1st of January 2016.

    This is the first journal dedicated purely to multiferroic and magnetoelectric materials. It publishes the latest high quality research papers, reviews by experts in the field, and short commentaries which could be a discussion, insight, foresight or opinion article.
    The main focus of the journal is Multiferroic Materials, i.e. those that combine two or more ferroic properties such as ferromagnetism, ferroelectricity, ferroelasticity and ferrotoroidicity. This covers materials which demonstrate ferroic (i.e. multiple hysteresis loop/switchable domain) coupling, but magnetoelectric materials with evidence of electrical/magnetic coupling are also of great interest. The scope of the journal also includes magneto-optical, electro-optical, magnetocaloric, electrocaloric, elastocaloric or toroidocaloric effects with application of an external field in multiferroic or magnetoelectric materials.

    Aims and Scope

    Why subscribe and read

    As the first journal dedicated purely to multiferroic and magnetoelectric materials, it positions itself as a hub for the most important and recent advances in the field. It  also contains authoritative reviews and opinions from experts in the subject, covering the past, present and future of multiferroics. The Open Access model allows ready access to its target audience and the peer-review system, together with the outstanding scientists of the Editorial Advisory Board, ensures that quality is maintained throughout.
    The journal is a forum for scientists carrying out research and/or interested in multiferroics, magnetoelectrics, and other coupled electrical-magnetic phenomena. As such, it is of particular interest to those in the Materials Science, Materials Engineering, Physics and Applied Physics areas, both in academia and industry.

    Why submit

    This is the only journal dedicated to multiferroic materials, and has a policy of quality over quantity, through the publication of high quality and original articles, which is maintained by the many prominent scholars on its Editorial Advisory Board. It presently has no publication fees, and will always be Open Access for readers.
    Manuscripts submitted to Multiferroic Materials are subjected to a fast, fair and constructive peer review process provided by leading experts in the field. Accepted papers are immediately published on an ongoing basis. We also offer free English language assistance for authors from non-English speaking regions, and a simple web-based manuscript submission and tracking system.


    Submission of Manuscripts

    Instructions for Authors


    Manuscripts should be submitted to the journal via Email to the Editorial Office at multiferroics.editorial@degruyteropen.com.

    Manuscript submitted to this journal should:

    • contain original work - not published elsewhere in any medium (in the whole or in part) by the authors or anyone else and not under consideration for publication in any other medium;
    • focus on the aims and scope of the journal;
    • be clearly and correctly written - should contain all essential features of a scientific publication that is easy to understand for the target audience;
    • written in English - attention to detail of the language will avoid severe misunderstandings which might lead to rejection of the paper;
    • be delivered in electronic format.

    The journal publishes:

    • Research Articles
    • Communications and Rapid Communications
    • Reviews and Mini-Reviews
    • Commentaries
    • Letters to the Editor and Amendments

    Formatting Requirements

    Our contributors are asked to make sure their submissions comply with rules governing the formatting. Although the journal can provide limited technical support, it is ultimately the responsibility of the author to deliver a properly formatted electronic version of the article.

    We accept submission of text, tables and figures as separate files or as a composite file. For your initial submission, we recommend you upload your entire manuscript, including tables and figures, as a single PDF file. If you are invited to submit a revised manuscript, please provide us with individual files: an editable text and publication-quality figures.

    • Text files can be submitted in the following formats: MS Word - standard DOCUMENT (.DOC) or RICH TEXT FORMAT (.RTF); PDF (not applicable for re-submitted or accepted manuscripts, see below)
    • Tables should be submitted as MS Word or PDF (not applicable for re-submitted or accepted manuscripts, see below). Please note that a straight Excel file is not an acceptable format
    • Graphics files can be submitted in any of the following graphic formats: EPS; BMP; JPG; TIFF; GIF or PDF. Please note that Powerpoint files are not accepted

    Any articles that have been prepared in LaTeX will be accepted for review, but only in PDF format. Post acceptance, text files of the revised manuscript and tables are required for use in the production. Authors are encouraged to use De Gruyter Open LaTeX template file.

    Authors should clearly indicate location of tables and figures in the text if these elements are given separately or at the end of the manuscript. If this information is not provided to the editorial office, we will assume that they should be left at the end of the text.

    It is important that authors include a cover letter with their manuscript. Please explain why you consider your manuscript as suitable for publication in Multiferroic Materials, why will your paper inspire the other members of your field, and how will it drive research forward.

    The letter should contain all important details such as:

    • your full name (submitted by) 
    • full title of article and short title 
    • full list of authors with affiliations 
    • e-mail of the corresponding author 
    • contact address, telephone/fax numbers of the corresponding author
    • number of attached files, if there is more than one
    • status: new, reviewed or accepted (with reference ID if reviewed or accepted)

    Cover letter should explicitly state that the manuscript (or one with substantially the same content, by any of the authors) has not been previously published in any language anywhere and that it is not under simultaneous consideration or in press by another journal. If related work has been submitted, then we may require a preprint to be made available. Reviewers will be asked to comment on the overlap between the related submissions.

    Manuscripts that have been previously rejected, or withdrawn after being returned for modification, may be resubmitted if the major criticisms have been addressed. The cover letter must state that the manuscript is a resubmission, and the former manuscript number should be provided.

    To ensure fair and objective decision-making, authors must declare any associations that pose a conflict of interest in connection with evaluated manuscripts (see Editorial Policy for details). Authors may suggest up to two referees not to use and in such cases additional justification should be provided in the cover letter. Authors are encouraged to recommend up to five reviewers who are not members of their institution(s) and have never been associated with them or their laboratory(ies); please provide contact information for suggested reviewers. The Editors reserve the right to select expert reviewers at their discretion.  For further instructions, please carefully follow the guidelines described in Instructions for Authors.

    Open Access License

    Authors have to sign an Open Access License that is available on the webpage. We encourage the authors to send the signed license along with the manuscript. Please note, that no article will be published unless the Open Access License is signed.

    More ...

    Abstracting & Indexing

    Multiferroic Materials is covered by the following services:

    • Baidu Scholar
    • CNKI Scholar (China National Knowledge Infrastructure)
    • CNPIEC
    • EBSCO (relevant databases)
    • EBSCO Discovery Service
    • Genamics JournalSeek
    • Google Scholar
    • J-Gate
    • JournalTOCs
    • KESLI-NDSL (Korean National Discovery for Science Leaders)
    • Naviga (Softweco)
    • Polish Scientific Journals Database
    • Primo Central (ExLibris)
    • Publons
    • ReadCube
    • Sherpa/RoMEO
    • Summon (Serials Solutions/ProQuest)
    • TDNet
    • Ulrich's Periodicals Directory/ulrichsweb
    • WanFang Data
    • WorldCat (OCLC)

    Editorial Information

    Journal Editor
    Robert C Pullar, University of Aveiro, Portugal

    Associate Editor
    Anna-Karin Axelsson, Imperial College London, UK

    Editorial Advisory Board
    Neil Alford, Imperial College London, UK
    Andrew Bell, University of Leeds, UK
    Amar Bhalla, University of Texas San Antonio, USA
    José Eiras, Universidade Federal de São Carlos, Brazil
    Stanislav Kamba, Institute of Physics, Academy of Sciences of the Czech Republic, Czech Republic
    Ram S. Katiyar, Puerto Rico University, USA
    Andrei Kholkin, University of Aveiro, Portugal
    Vaijayanti Palkar, Indian Institute of Technology, Bombay, India
    Ian Reaney, University of Sheffield, UK
    Avadh Saxena, Los Alamos National Lab, USA
    Nava Setter, Swiss Federal Institute of Technology, (EPFL), Switzerland
    Nicola Spaldin, ETH Zurich, Switzerland
    Alexander Tagantsev, Swiss Federal Institute of Technology, (EPFL), Switzerland

    Assistant Editors
    Indrani Coondoo, University of Aveiro, Portugal
    Barbara Fraygola, Universidade Federal de São Carlos, Brazil / Swiss Federal Institute of Technology, (EPFL), Switzerland
    Fabio Zabboto, Universidade Federal de São Carlos, Brazil
    Yuan Zhou, BMDL, CEHMS, Virginia Tech, Blacksburg, USA

    Bogumiła Zuga 32A Str.
    01-811 Warsaw, Poland
    T: +48 22 701 50 15

    Editorial Office
    Robert C. Pullar

    Comments (0)

    Please log in or register to comment.
    Log in