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Open Physics

formerly Central European Journal of Physics

Editor-in-Chief: Seidel, Sally

Managing Editor: Lesna-Szreter, Paulina


IMPACT FACTOR 2018: 1.005

CiteScore 2018: 1.01

SCImago Journal Rank (SJR) 2018: 0.237
Source Normalized Impact per Paper (SNIP) 2018: 0.541

ICV 2017: 162.45

Open Access
Online
ISSN
2391-5471
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Volume 7, Issue 2

Issues

Volume 13 (2015)

Structural, morphology and electrical properties of layered copper selenide thin film

J. Ying Chyi Liew / Zainal Talib / W. Mahmood / M. Yunus / Zulkarnain Zainal / Shaari Halim / Mohd Moksin / Wan Yusoff / K. Pah Lim
Published Online: 2009-04-26 | DOI: https://doi.org/10.2478/s11534-009-0057-1

Abstract

Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed.

Keywords: CuSe thin films; electrical conductivity; surface roughness; film thickness; grain size

PACS: 71.20.Nr; 72.20.-i; 73.21.Ac; 73.25.+i; 73.50.-h

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About the article

Published Online: 2009-04-26

Published in Print: 2009-06-01


Citation Information: Open Physics, Volume 7, Issue 2, Pages 379–384, ISSN (Online) 2391-5471, DOI: https://doi.org/10.2478/s11534-009-0057-1.

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© 2009 Versita Warsaw. This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License. BY-NC-ND 3.0

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