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tm - Technisches Messen

Plattform für Methoden, Systeme und Anwendungen der Messtechnik

[TM - Technical Measurement: A Platform for Methods, Systems, and Applications of Measurement Technology
]

Editor-in-Chief: Puente León, Fernando / Zagar, Bernhard


IMPACT FACTOR 2018: 0.594

CiteScore 2018: 0.54

SCImago Journal Rank (SJR) 2018: 0.261
Source Normalized Impact per Paper (SNIP) 2018: 0.563

Online
ISSN
2196-7113
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Volume 85, Issue 5

Issues

Implantable multi-sensor system for hemodynamic controlling

Implantierbares Multisensorsystem zur kardiovaskulären Überwachung physiologischer Parameter

Jens Weidenmüller / Oezgue Dogan / Alexander Stanitzki / Mario Baum / Tim Schröder / Dirk Wünsch / Michael Görtz / Anton Grabmaier
Published Online: 2018-04-14 | DOI: https://doi.org/10.1515/teme-2017-0116

Abstract

A miniaturized implantable multi-sensor system for cardiovascular monitoring of physiological parameters is presented. High accuracy pressure measurements within the vessel can be performed by a capacitive pressure sensor. Additional information about the patient, e. g., sudden movement, inclination or increased temperature can be obtained by additional sensor components such as an acceleration sensor and a temperature sensor unit. This information facilitates compensation of interferences for more accurate pressure measurements. A multi-functional ASIC enables, amongst others, sensor signal processing, power management and telemetric communication with extracorporeal electronics. Sensor chips, the multi-functional ASIC and passive components are assembled on a LTCC circuit board in which an antenna coil is integrated for telemetric energy and data transmission at a frequency of 13.56 MHz. In order to support further miniaturization, the implant shall be encapsulated with a stack of very thin and hermetic ceramics applied by ALD instead of using bulky metal housings. Further encapsulation with polymers, which can be functionalised with appropriate biomolecules, is necessary for a proper shape, a biocompatible interface to the surrounding tissue and, thereby, reduction of thrombogenicity.

Zusammenfassung

In diesem Beitrag wird ein miniaturisiertes implantierbares Multisensorsystem zur kardiovaskulären Überwachung physiologischer Parameter vorgestellt. Die präzise Druckmessung in den Blutgefäßen wird dabei mit einem kapazitiven Drucksensor durchgeführt. Zusätzliche Informationen über den Patienten, z. B. plötzliche Bewegung, Neigung oder erhöhte Temperaturen, werden durch zusätzliche Sensoren, wie einem Beschleunigungssensor und einem Temperatursensor, erzielt. Diese Informationen ermöglichen die Kompensation von verschiedenen Einflussgrößen für genauere Druckmessungen. Die Signalverarbeitung, das Energiemanagement und die telemetrische Kommunikation mit einer extrakorporalen Elektronik erfolgt über einen eigens für die Aufgabe angefertigten multifunktionalen ASIC. Auf der Implantatseite werden auf einer LTCC-Platine, in der eine Antenne zur telemetrischen Energie- und Datenübertragung mit einer Frequenz von 13,56 MHz integriert ist, die Sensoren, der multifunktionale ASIC und die benötigten passiven Komponenten integriert. Um einen möglichst hohen Grad der Miniaturisierung zu erzielen, soll das Implantat, anstelle eines typischen Metallgehäuses, mit einem Schichtstapel sehr dünner und hermetisch dichter Keramiklagen (mittels ALD) verkapselt werden. Eine weitere Verkapselung mit Polymeren ist für die Formgebung notwendig. Abschließend erfolgt eine Funktionalisierung mit Biomolekülen, um eine biokompatible Grenzfläche zum umgebenden Gewebe und damit eine Reduktion der Thrombogenität zu erzielen.

Keywords: Pressure sensor; acceleration sensor; temperature sensor; monitoring of blood pressure; implant encapsulation; assembly and packaging

Schlagwörter: Drucksensor; Beschleunigungsensor; Temperatursensor; Blutdrucküberwachung; Implantatverkapselung; Aufbau- und Verbindungstechnik

References

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    H. Dudaicevs, M. Kandler, Y. Manoli, W. Mokwa, and E. Spiegel. Surface micromachined pressure sensors with integrated CMOS read-out electronics. Sensors and Actuators A: Physical, 43:157–163, 04 1994.Google Scholar

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    G. Urban and A. Bunge. VDE-Positionspapier Theranostische Implantate. Verband der Elektrotechnik Elektronik Informationstechnik e.V. und Deutsche Gesellschaft für Biomedizinische Technik im VDE e. V., 2011.Google Scholar

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    J. Weidenmueller, Ch. Walk, O. Dogan, P. Gembaczka, A. Stanitzki, and M. Goertz. Telemetric multi-sensor system for medical applications – The approach. Technisches Messen tm, 84, 2017.Web of ScienceGoogle Scholar

About the article

Jens Weidenmüller

Dr J. Weidenmüller received the Diploma degree in physical engineering from the RheinAhrCampus in Remagen in 2007. He subsequently worked as scientific assistant in the field of sensor development, from 2007 to 2010 at the RheinAhrCampus and from 2011 to 2014 at the Hochschule RuhrWest. From 2010 to 2014 he was additionally a PhD student at the Technical University Chemnitz. In July 2014 he obtained the academic degree (Dr-Ing.) with the thesis: “Optimization of encircling eddy current sensors for online monitoring of hot rolled round steel bars”. Since 2014 he works in the business field pressure sensor systems within Fraunhofer IMS and lectures electrical engineering at the Hochschule RuhrWest.

Oezgue Dogan

Ö. Dogan received the B.Sc. and M.Sc. degrees from the Technical University of Berlin (TUB), Germany, in 2013 and 2015, respectively. She studied electrical engineering with a focus on microsystems and medical-electronic systems. From 2011 until 2015 she was a student assistant at the Department of High-Frequency and Semiconductor System Technologies at TUB. Since 2015 she is with Fraunhofer IMS and is working as PhD student in the field of advanced implant encapsulations.

Alexander Stanitzki

A. Stanitzki received the Diploma degree in electrical engineering from the Ruhr-University Bochum in 2008. From 2007 to 20011 he worked at advICo microelectronics GmbH as an IC design engineer for RF-mixed-signal and radhard applications. Since 2012 he is leading the Mixed Signal IC Design group within Fraunhofer IMS, with a focus on energy harvesting medical implants, industrial precision sensor readout ICs and functional safety in analog ICs.

Mario Baum

Dr M. Baum (M) received a combined MBE (Master of Business and Engineering) and a Ph.D. degree at Chemnitz University of Technology and started working as an application engineer for a company called GEMAC GmbH Chemnitz in the field of MEMS. In 2002 he joined the team of Prof. Gessner at Fraunhofer ENAS as a scientist with both research and marketing tasks. Currently his work is focused on MEMS packaging, microsystems as well as medical and biomedical packaging topics. He is author and co-author of more than 50 papers including 5 patent applications on packaging issues. Since 2014 he has been working as a team leader for the integration technologies research team, and up today he is deputy department head of the department System Packaging at Fraunhofer ENAS.

Tim Schröder

T. Schröder received the B.Sc. and M.Sc. degrees from Hamburg University of Technology and Chemnitz University of Technology, Germany, in 2013 and 2015, respectively. He studied mechanical engineering and mechatronics with a focus on microtechnology. From 2014 to 2016 he was a student assistant at Fraunhofer ENAS and at Tanaka Shuji MEMS Laboratory, Japan, working on novel electroplating and integration techniques for microsystems. Since 2016, he is with ENAS, working in the field of microsystem packaging.

Dirk Wünsch

D. Wünsch received the Diploma degree in Microtechnology/Mechatronics from the Chemnitz University of Technology in 2008. After taking the graduate engineer he started working as an application engineer for the university in Chemnitz in the field of micromechanical sensor systems. In 2014 he joined the team of Prof. Gessner at Fraunhofer ENAS (formerly Fraunhofer IZM) as a scientist. Currently his research work is focused on MEMS packaging and microsystems for medical and harsh environment applications.

Michael Görtz

M. Görtz received his Diploma from Niederrhein University of Applied Sciences in 2001 in electrical engineering with focus on electrical/optical communication and the production technologies of micro systems. From 2001 to 2004 he was at Fraunhofer IMS to design and test neuronal vision prosthesis with micro system technologies. Between 03/2004 and 02/2005 Institute of Materials in Electrical Engineering 1 at RWTH Aachen University working on active implantable medical devices. Since 03/2005 he is back at Fraunhofer IMS and responsible for development of medical implants. Actually he is Group manager and head of the business field Pressure Sensor Systems.

Anton Grabmaier

A. Grabmaier is the director of the Fraunhofer Institute for Microelectronic Circuits and Systems since 2006. He was born in 1963. Before 2006 he worked at one of the global leading companies for component suppliers of electronics and mechatronics, i. e. Siemens VDO Automotive in Regensburg. Since 1999 he responsibly as in charge of the predevelopment of sensors and took the responsibility for marketing and product development at international level. Furthermore he worked several years at Valeo Circuits and Sensors in Bietigheim-Bissingen (formerly ITT Automotive Europe), where he was head of sensor and cartridgetechnology in the end. The physicist studied at the University in Stuttgart, he focused on semiconductor physics and measuring technique. In his graduation, he concentrated on laser diodes.


Received: 2017-09-18

Revised: 2018-03-18

Accepted: 2018-03-18

Published Online: 2018-04-14

Published in Print: 2018-05-25


The results are based on work supported by the Fraunhofer-Gesellschaft Lighthouse Project. All together twelve Fraunhofer Institutes led by the Fraunhofer Institute for Biomedical Engineering IBMT have joined forces to work on the project “Theranostic Implants”.


Citation Information: tm - Technisches Messen, Volume 85, Issue 5, Pages 359–365, ISSN (Online) 2196-7113, ISSN (Print) 0171-8096, DOI: https://doi.org/10.1515/teme-2017-0116.

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