The integration of dies is a possibility to reduce the number of conducting tracks within electrical active implants. For passive microelectrode arrays the number of conducting tracks limits the number of electrodes. By embedding an array of small dies (250 μm edge length) employed to amplify and multiplex the signals of 25 electrodes each into a flexible foil we create a flexible active microelectrode array with more than 1000 electrodes. A fabrication process was developed containing a transfer process for the dies as well as an embedding procedure. Here a non-functional Dummy-System is presented as a demonstrator proving the feasibility of the proposed microelectrode array.
Current Directions in Biomedical Engineering is an open access journal and closely related to the journal
Biomedical Engineering - Biomedizinische Technik.CDBME is a forum for the exchange of knowledge in the fields of biomedical engineering, medical information technology and biotechnology/bioengineering for medicine and addresses engineers, natural scientists, and clinicians working in research, industry, or clinical practice.