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Impact Factor

High Temperature Materials and Processes

Editor In Chief: Hiroyuki Fukuyama

From volume 2019, High Temperature Materials and Processes has become an open access journal. Publication costs are covered by so called Article Processing Charges (APC), paid by authors' affiliated institutions, funders or sponsors. All manuscripts published in 2019 are subject to APC.

Your Benefits

  • Highly ranked journal with increasing Impact Factor
  • Recognized editorial board and insightful reviews
  • Comprehensive outlook on problematic aspects of HTMP’s topics
  • Ahead of print publishing

High Temperature Materials and Processes offers an international publication forum for new ideas, insights and results related to high-temperature materials and processes in science and technology. The journal publishes original research papers and short communications addressing topics at the forefront of high-temperature materials research including processing of various materials at high temperatures. Occasionally, reviews of a specific topic are included. The journal also publishes special issues featuring ongoing research programs as well as symposia of high-temperature materials and processes, and other related research activities.

Emphasis is placed on the multi-disciplinary nature of high-temperature materials and processes for various materials in a variety of states. Such a nature of the journal will help readers who wish to become acquainted with related subjects by obtaining information of various aspects of high-temperature materials research. The increasing spread of information on these subjects will also help to shed light on relevant topics of high-temperature materials and processes outside of readers’ own core specialties.


  • High-temperature applications and behavior of metals and alloys, intermetallic compounds, oxide ceramics, and non-oxide ceramics such as nitrides, carbides, borides, and graphite
  • Polymers, glasses and glassy metals, composite materials
  • Oxidation and environmental attack, High-temperature corrosion
  • Design with high-temperature materials
  • Processes for achieving high temperature
  • Processing of materials involving lasers, plasma, and arc sources
  • Materials and processes involved in using solar energy
  • Materials in nuclear energy applications
  • Thermochemistry, Kinetics of reactions
  • Liquid metal processing, Rapid solidification processes

For the information on Article Processing Charges please go to the Supplementary Information section below and view "Article Processing Charges" document (in PDF).

Detailed information on Editorial Policy, Publication Ethics, Instructions for Authors etc. can be found below and in the Supplementary Information section.

Special Issues:

Journal Parnters:

Journal Metrics

5-year Impact Factor
Cite Score
Impact Factor
SCImago Journal Rank
Source Normalized Impact per Paper


Previously published by Freund Publishing House Ltd.

Abstracting & Indexing

High Temperature Materials and Processes is covered by the following services:

  • Astrophysics Data System (ADS)
  • Baidu Scholar
  • Chemical Abstracts Service (CAS) - CAplus
  • Chemical Abstracts Service (CAS) - SciFinder
  • Chimica
  • Chronos Hub
  • CNKI Scholar (China National Knowledge Infrastructure)
  • CNPIEC - cnpLINKer
  • Dimensions
  • DOAJ (Directory of Open Access Journals)
  • EBSCO (relevant databases)
  • EBSCO Discovery Service
  • Ei Compendex
  • Engineering Village
  • Genamics JournalSeek
  • Google Scholar
  • Index Copernicus
  • Inspec
  • Japan Science and Technology Agency (JST)
  • J-Gate
  • Journal Citation Reports/Science Edition
  • JournalGuide
  • JournalTOCs
  • KESLI-NDSL (Korean National Discovery for Science Leaders)
  • Microsoft Academic
  • MyScienceWork
  • Naver Academic
  • Naviga (Softweco)
  • Paperbase
  • Polymer Library
  • Primo Central (ExLibris)
  • ProQuest (relevant databases)
  • Publons
  • QOAM (Quality Open Access Market)
  • ReadCube
  • Reaxys
  • SCImago (SJR)
  • Semantic Scholar
  • Sherpa/RoMEO
  • Summon (ProQuest)
  • TDNet
  • TEMA Technik und Management
  • Ulrich's Periodicals Directory/ulrichsweb
  • WanFang Data
  • Web of Science - Current Contents/Engineering, Computing, and Technology
  • Web of Science - Science Citation Index Expanded
  • WorldCat (OCLC)
  • Yewno Discover

Volume 39 (2020): Issue 1 (Jan 2020)

Instructions for Authors

You can easily submit your manuscript online. Simply go to https://www.editorialmanager.com/htmp and you will be guided through the whole peer-reviewing and publishing process.

Your benefits of publishing with us:

  • Rapid review and publication times
  • Significant impact per publication
  • Every article easily discoverable because of Search Engine Optimization (SEO) and comprehensive abstracting and indexing services
  • Convenient citation tracking via e-mail alert
  • Secure archiving by De Gruyter and the independent archiving service Portico
  • Professional sales and marketing activities

Manuscript submitted to this journal should:

  • contain original work - not published elsewhere in any medium (in the whole or in part) by the authors or anyone else and not under consideration for publication in any other medium;
  • focus on the aims and scope of the journal;
  • be clearly and correctly written - should contain all essential features of a scientific publication that is easy to understand for the target audience;
  • written in English - attention to detail of the language will avoid severe misunderstandings which might lead to rejection of the paper;
  • be delivered in electronic format.

The journal publishes:

  • Research Articles
  • Communications and Rapid Communications
  • Reviews and Mini-Reviews
  • Commentaries
  • Letters to the Editor and Amendments

Manuscripts have to be written in LATEX (preferable), AMS-TEX, AMS-LATEX or MS Word - standard DOCUMENT (.DOC). We do not accept papers in Plain TEX format. If additionally a PDF file is supplied, the peer review process will speed up. Authors are encouraged to submit the final version of the paper using the De Gruyter Open LATEX template. For detailed information, please see Instruction for Authors.

The journal uses a closed single-blind peer review system.
Unpublished material: Submission of a manuscript implies that the work described is not copyrighted, published or submitted elsewhere, except in abstract form. The corresponding author should ensure that all authors approve the manuscript before its submission.
Ethical conduct of research: The authors must describe and confirm safeguards to meet ethical standards when applicable. See Editorial Policy for details.
Conflict of interest: When authors submit a manuscript, they are responsible for recognizing and disclosing financial and/or other conflicts of interest that might bias their work and/or could inappropriately influence his/her judgment. If no specified acknowledgment is given, the Editors assume that no conflict of interest exists. Authors are encouraged to fill in the ICMJE Conflicts of Interest Form (available here) and send it in the electronic format to the Managing Editor.

Copyright: All authors retain copyright, unless - due to their local circumstances - their work is not copyrighted. The non-commercial use of each article will be governed by the Creative Commons Attribution-NonCommercial-NoDerivs license. The corresponding author grants the journal exclusive license for commercial use of the article, by signing the License to Publish. Open Access License is available on the webpage. We encourage the authors to send the signed license along with the manuscript. Please note, that no article will be published unless the Open Access License is signed.

Authorship: Authorship should be limited to those who have made a significant contribution to the conception, design, execution, or interpretation of the reported study. All those who have made significant contributions should be listed as co-authors. Where there are others who have participated in certain substantive aspects of the research project, they should be named in an Acknowledgement section. The corresponding author should ensure that all appropriate co-authors (according to the above definition) and no inappropriate co-authors are included in the author list of the manuscript and that all co-authors have seen and approved the final version of the paper and have agreed to its submission for publication.

Peer Review process: The Editors reserve the right to decline the submitted manuscript without review, if the studies reported are not sufficiently novel or important to merit publication in the journal. Manuscripts deemed unsuitable (insufficient originality or of limited interest to the target audience) are returned to the author(s) without review. The Editor seeks advice from experts in the appropriate field. Research articles and communications are refereed by a minimum of two reviewers, review papers by at least three. Authors are requested to suggest persons competent to review their manuscript. However, please note that this will be treated only as a suggestion, and the final selection of reviewers is exclusively the Editor's decision. The final decision of acceptance is made by the Managing Editor or, in case of conflict, by the Editor-in-Chief.

Scientific Misconduct: This journal publishes only original manuscripts that are not also published or going to be published elsewhere. Multiple submissions/publications, or redundant publications (re-packaging in different words of data already published by the same authors) will be rejected. If they are detected only after publication, the journal reserves the right to publish a Retraction Note. In each particular case Editors will follow COPE's Code of Conduct and implement its advice

Hiroyuki Fukuyama, Tohoku Univeristy, Japan

Associate Editors
Hiroyuki Shibata, Tohoku Univeristy, Japan
Yutaka Sato, Tohoku Univeristy, Japan

Editorial Advisory Board
Yoshio Waseda, Tohoku Univeristy, Japan
Hans -J. Fecht, Ulm University, Germany
Ramana G. Reddy, The university of Alabama, USA
Michel Baron, Campus Jarlard-Route de Teillet, France
Wei Gao, The University of Auckland, New Zealand
Andreas Glaeser, University of California, USA
Zbigniew Grzesik, AGH University of Science and Technology, Poland
Jeff Th.M. de Hosson, University of Groningen, The Netherlands
Thomas Jacob Kallarackel, Indian Institute of Science, India
Georges Kipouros, Dalhousie Univeristy, Canada
Indranil Manna, Indian Institute of Technology, India
Toru Okabe, The University of Tokyo, Japan
Oleg Ostrovski, The University of New South Wales, Australia
Koulis Pericleous, University of Greenwich, UK
Seshadri Seetharaman, KTH Royal Institute of Technology, Sweden
Boris Straumal, Russian Academy of Science, Russia
Shigeru Suzuki, Tohoku University, Japan
Toshihiro Tanaka, Osaka Univeristy, Japan
Peter Terzieff, University of Vienna, Austria
Satoshi Uda, Tohoku University, Japan
Knut W. Urban, Forschungsentrum Julich GmbH, Germany
Kunihiko Nakashima, Kyushu University, Japan
Tohru Sekino, Osaka Univeristy, Japan

Uceu Suhuddin, Helmholtz-Zentrum Geesthacht, German
Ke Chen, Shanghai Jiao Tong University,China
Che-Wei, Tsai National Tsing Hua University, Taiwan
Murshid Imam, Indian Institute of Technology Patna, India
Sun-Joong, Kim Chosun university, Korea
Anrin Bhattacharyya, Montanuniversität Leoben, Austria
Björn Glaser, KTH Royal Institute of Technology, Sweden
Wanlin Wang, Central South University, China
Jin-ichiro Nakano, National Energy Technology Laboratory, USA
Kinnor Chattopadhyay, University of Toronto, Canada
Shigeru Ueda, Tohoku University, Japan
Noritaka Saito, Kyushu University, Japan

Language Editors
Emmanuel Gonzalez Escobar, Lancaster University, UK
Julio Gonzalez-Saenz, University of Portsmouth, UK

Editorial Contact
Ewa Chmielewska





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